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A Wafer of Polyethylene: Ultrathin polyethylene films made of nanocrystals

Layers of plastic, much thinner than a strand of hair—this type of ultrathin polymer film is of great interest to scientists and engineers. Applications include protective coatings, for example. A research team led by Stefan Mecking at the University of Konstanz has now developed a new method to produce wafer-thin layers. As reported in the journal Angewandte Chemie, the scientists made their films from individual prefabricated nanocrystal building blocks.

SRC-Supported Stanford Researchers Overcome Mispositioned Carbon Nanotubes to Create Logic Circuits at Wafer-Scale

Taming of Unruly CNTs, Demonstration of Full Wafer-Scale Growth, Transfer and Integration Are Steps Toward Making Nanotube Circuits Commercially Viable

EV Group Files Patent Infringement Lawsuit Against the 3M Company

EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced that it has filed a patent infringement lawsuit in federal court of New York against the 3M Company ("3M"). The complaint alleges that 3M has infringed upon a U.S. Patent through the marketing and sale of the 3M Wafer Support System, which is used in the production of silicon wafers. The complaint seeks damages to compensate EVG for 3M's wrongful infringement and an injunction against 3M from all future infringement of the Patent.

EV Group Files Patent Infringement Lawsuit Against the 3M Company

ST. FLORIAN, Austria, July 14 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced that it has filed a patent infringement lawsuit in federal court of New York against the 3M Company ("3M"). The complaint alleges that 3M has infringed upon a U.S. Patent through the marketing and sale of the 3M Wafer Support System, which is used in the production of silicon wafers. The complaint seeks damages to compensate EVG for 3M's wrongful infringement and an injunction against 3M from all future infringement of the Patent.

EV Group Files Patent Infringement Lawsuit Against the 3M Company

ST. FLORIAN, Austria, July 14 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced that it has filed a patent infringement lawsuit in federal court of New York against the 3M Company ("3M"). The complaint alleges that 3M has infringed upon a U.S. Patent through the marketing and sale of the 3M Wafer Support System, which is used in the production of silicon wafers. The complaint seeks damages to compensate EVG for 3M's wrongful infringement and an injunction against 3M from all future infringement of the Patent.

EV Group Files Patent Infringement Lawsuit Against the 3M Company

ST. FLORIAN, Austria, July 14 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced that it has filed a patent infringement lawsuit in federal court of New York against the 3M Company ("3M"). The complaint alleges that 3M has infringed upon a U.S. Patent through the marketing and sale of the 3M Wafer Support System, which is used in the production of silicon wafers. The complaint seeks damages to compensate EVG for 3M's wrongful infringement and an injunction against 3M from all future infringement of the Patent.

Scientists Pave Way For 25nm CPUs

arcticstoat writes in with word that scientists at the Space Nanotechnology Laboratory at MIT have found a new way of extending Moore's law into the future — they have succeeded in etching a grid of 25nm lines into a silicon wafer. The article notes that this technique could be used for writing the grid on which chips are laid down, but that the electronic elements would have to be written using more complex techniques. "[Researchers] created an interference pattern using light from a laser with a wavelength of 351 nm. The pattern consists of alternating light and dark zones repeating every 200 nm. This allowed them to etch 25-nm lines into a silicon wafer, each 175 nm apart. They then repeated the process three times, each time shifting the interference pattern by 50 nm and etching another 25-nm groove.

SAMSUNG ELECTRONICS BEGINS PRODUCTION AT SINGAPORE WAFER PLANT

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Revolutionary new technology for nanoscale assembly at wafer level

NSTI, CTSI, and TechConnect Announce the Global Showcase of Advanced Technology Initiatives, Innovations and Intellectual Property

Researchers Develop Revolutionary Technology for Nanoscale Assembly at Wafer Level

Researchers at the NSF Nanoscale Science and Engineering Center for High-rate Nanomanufacturing (CHN) at Northeastern University, with partners UMass Lowell and University of New Hampshire, have discovered an innovative technology that will have a tremendous impact on the nanotechnology industry.

Researchers Develop Revolutionary Technology for Nanoscale Assembly at Wafer Level

Researchers at the NSF Nanoscale Science and Engineering Center for High-rate Nanomanufacturing (CHN) at Northeastern University, with partners UMass Lowell and University of New Hampshire, have discovered an innovative technology that will have a tremendous impact on the nanotechnology industry.

Nanomanufacturing Center Develops Revolutionary Technology for Nanoscale Assembly at Wafer Level

Nanotech 2008, the largest and most comprehensive technical and business event in nanotechnology world-wide. SUSS MicroTec: Nanoimprint Lithography (NIL) CRAIC Technologies™ is a leading developer of instruments for UV-visible-NIR microanalysis. Spectra and images

Researchers overcome mispositioned carbon nanotubes to create logic circuits at wafer-scale

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SRC-Supported Stanford Researchers Overcome Mispositioned Carbon Nanotubes to Create Logic Circuits at Wafer-Scale

RESEARCH TRIANGLE PARK, N.C.—(BUSINESS WIRE)—June 20, 2008— Semiconductor Research Corporation (SRC), the world

SRC-Supported Stanford Researchers Overcome Mispositioned Carbon Nanotubes to Create Logic Circuits at Wafer-Scale

TMC Launches New Web Sites: Cable | WiMAX | ITEXPO West begins in: Register Now! | NXTcomm News Coverage

SRC-Supported Stanford Researchers Overcome Mispositioned Carbon Nanotubes to Create Logic Circuits at Wafer-Scale

Broadband Service Provider Trident SR Sdn. Bhd.

Northeastern University's Center for High-rate Nanomanufacturing Develops Revolutionary Technology for Nanoscale Assembly at Wafer Level

Prototype will be showcased at Nano Science & Technology Instituteís Nanotech 2008 Conference in Boston at Booth #211

Nantero and SVTC team on carbon nano-tube process commercialization

Home arrow News arrow Wafer Processing arrow Nantero and SVTC team on carbon nano-tube process commercialization

IBM announces $1.5 billion investment in New York operations

Home arrow News arrow Wafer Processing arrow IBM announces $1.5 billion investment in New York operations

WACKER SCHOTT Solar plans site expansion in Jena, Germany

10 Jun 2008 - After commissioning a new wafer production facility at the so-called "Jena Site 2" in mid-April, WACKER SCHOTT Solar GmbH is continuing its production-site expansion. The company announced this during a visit by Jena mayor Albrecht Schröter. The expansion measures focus on construction of a new crystal-growing facility. The extension is a key component of a EUR370 million investment program aimed at ensuring the announced production-capacity expansion to one gigawatt by 2012. The measure will create 150 new jobs at the site.

EV Group Files Patent Infringement Lawsuit Against the 3M Company

PRNewswire/ -- EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced that it has filed a patent infringement lawsuit in federal court of

EV Group Files Patent Infringement Lawsuit Against the 3M Company

PRNewswire/ -- EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced that it has filed a patent infringement lawsuit in federal court of

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