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Hamamatsu - CMOS digital photo IC for colour sensing

Hamamatsu - CMOS digital photo IC for colour sensingA new 12-bit digital output colour sensor photo IC has been introduced by Hamamatsu Photonics. The new S9706(X) device consists of a matrix photodiode array, coupled to an RGB (red, green and blue) filter matrix to give colour response.

IC distributor KCUC seeing stronger sales in December thanks to recovery of small handset companies in China

Market observers estimate IC distributor Kuen Chaang Uppertech's (KCUC's) December sales are to recover by 10% thanks to small handset customers in China.

Burda:ic Brings The Power Of The Elements To Florensia

December 5, 2008 - Burda:ic, a publisher of online games worldwide, today released a major update for the free-to-play, maritime MMORPG Florensia. The update includes a number of smaller changes, from land quest balancing to slight modifications to the user interface, but the biggest addition comes in the form of elemental resistances and attributes. These additions permeate the structure of the entire game so players both new and old will find the fantasy world of Florensia an exciting and dangerous place to adventure.

Taiwan consumer electronics IC players say demand may not recover until after Lunar New Year

Since order visibility for consumer electronics ICs is still low and IC distributors have not yet cleared out their inventories, December sales of consumer electronics ICs are expected to decline from November.

CMOS Digital Photo IC for Colour Sensing

Hamamatsu Photonics has introduced the 12-bit digital output colour sensor Photo IC. The new S9706(X) device consists of a matrix photodiode array, coupled to a RGB (red, green and blue) filter matrix to give colour response. The device is combined with "in house" CMOS processing electronics and is all within a monolithic silicon chip. The output of the S9706(X) is in 12-bit digital format with the colour intensity of red, green and blue read out sequentially at potentially high speed.

Silicon Image Introduces 225 MHz HDMI v1.3 PHY IC and Soft Link IP Core for Consumer Electronics Applications

Silicon Image Introduces 225 MHz HDMI v1.3 PHY IC and Soft Link IP Core for Consumer Electronics Applications

NEC Electronics Highlights Power Management IC Technology for Mobile Internet Devices at CES 2009

SANTA CLARA, Calif.--(Business Wire)-- NEC Electronics America, Inc. today announced that it will highlight its power management IC (PMIC) technology at the International Consumer Electronics Show (CES®), January 8 - 11, 2009. The live demonstration will feature NEC Electronics` PMIC solution for Intel`s next-generation Mobile Internet Device (MID) platform, codenamed Moorestown. The NEC Electronics PMIC solution combines power management, logic, user interface, plus audio and voice communications functions to maximize battery life, support high levels of integration and minimize board space. This solution enables the development of a new class of devices that will bring broadband wireless Internet access, multimedia playback, navigation, gaming, social networking and other Web 2.

NEC Electronics Highlights Power Management IC Technology for Mobile Internet Devices at CES 2009

SANTA CLARA, Calif., Jan 06, 2009 (BUSINESS WIRE) -- NELTY | Quote | Chart | News | PowerRating -- NEC Electronics America, Inc. today announced that it will highlight its power management IC (PMIC) technology at the International Consumer Electronics Show (CES(R)), January 8 - 11, 2009. The live demonstration will feature NEC Electronics' PMIC solution for Intel's next-generation Mobile Internet Device (MID) platform, codenamed Moorestown.

EV Group Introduces New Suite of Aligners and Measurement Systems for 3D IC and Other Advanced Semiconductor, MEMS and Nanotechnology Device Manufacturing

PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the NT series -- a new, yet already field-proven suite of mask aligners, wafer-to-wafer (W2W) bond aligners and measurement systems -- to address increased demand for higher precision alignment accuracy. The shift to smaller geometries along with more feature-dense packages adds a host of challenges, surrounding precision alignment capabilities, which can greatly impact device failure intolerance and, ultimately, yield and cost. The new EVG-NT series offers dramatically increased alignment accuracy -- in the range of 1 um down to 0.1 um -- for the manufacture of advanced MEMS, compound semiconductor, silicon-based power, 3D IC and nanotechnology devices -- unlike anything el

EV Group Introduces New Suite Of Aligners And Measurement Systems For 3D IC And Other Advanced Semiconductor, MEMS And Nanotechnology Device Manufacturing

St. Florian, Austria - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, reecntly introduced the NT series -- a new, yet already field-proven suite of mask aligners, wafer-to-wafer (W2W) bond aligners and measurement systems -- to address increased demand for higher precision alignment accuracy. The shift to smaller geometries along with more feature-dense packages adds a host of challenges, surrounding precision alignment capabilities, which can greatly impact device failure intolerance and, ultimately, yield and cost. The new EVG-NT series offers dramatically increased alignment accuracy -- in the range of 1 um down to 0.1 um -- for the manufacture of advanced MEMS, compound semiconductor, silicon-based power, 3D IC and nanotechnology devices -- unlike a

EV Group Introduces New Suite Of Aligners And Measurement Systems For 3D IC And Other Advanced Semiconductor, MEMS And Nanotechnology Device Manufacturing

St. Florian, Austria - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the NT series -- a new, yet already field-proven suite of mask aligners, wafer-to-wafer (W2W) bond aligners and measurement systems -- to address increased demand for higher precision alignment accuracy. The shift to smaller geometries along with more feature-dense packages adds a host of challenges, surrounding precision alignment capabilities, which can greatly impact device failure intolerance and, ultimately, yield and cost. The new EVG-NT series offers dramatically increased alignment accuracy -- in the range of 1 um down to 0.1 um -- for the manufacture of advanced MEMS, compound semiconductor, silicon-based power, 3D IC and nanotechnology devices -- unlike anyt

EV Group and Brewer Science Establish Ultra-thin Wafer Bonding Lab in Taiwan: Localized Support to Address Increased Demand for 3D IC Process Developm

EV Group (EVG) and Brewer Science, Inc., today announced the installation of an EVG 500 series wafer-bonding system at Brewer Science's Taiwan applications lab. Located in Hsinchu Science Park, this joint effort offers customers timely localized support in the Asia-Pacific region for 3D IC and other advanced process development programs. In a shared commitment to speed commercialization of through-silicon via (TSV) technology and enable the development of smaller, higher performance, and more power-efficient electronic devices, this move is set to continue the momentum of their joint development efforts.

Publishing Technology Announces IngentaConnect Mobile

Publishing Technology plc, a provider of online systems, software, and supply-chain services to information providers and publishers, announced IngentaConnect mobile, a new trial product that allows subscribers to read articles and abstracts on their mobile devices. The beta product is being trialed by a number of academic publishers, which already have journals and articles on IngentaConnect (IC). 'IngentaConnect mobile' is being provided in alliance with the Dutch mobile media specialists Momac. Publishing Technology is also introducing an internal service to help publishers on IC move from PDF to an XML format by providing a combined typesetting and digital production offer.

Nanotech Semiconductor announces CMOS limiting amp IC for 1.25 Gbps

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Silicon Image Introduces 225 MHz HDMI v1.3 PHY IC and Soft Link IP Core for Consumer Electronics Applications

Silicon Image, Inc. (NASDAQ:SIMG), a leader in semiconductors and intellectual property for the secure distribution, presentation and storage of high-definition content, today announced its 225 MHz HDM version 1.3 PHY solution, consisting of the SiI9204 HDMI v1.3 transmitter PHY semiconductor and companion HDMI v1.3 link layer intellectual property (IP) core for use in consumer electronics and high-end mobile device applications. This latest offering complements the Silicon Image family of HDMI v1.3 transmitters which include stand-alone discrete semiconductors, PHY semiconductors for use with link layer IP cores and full HDMI v1.3 link and PHY IP cores.

Silicon Image Introduces 225 MHz HDMI v1.3 PHY IC and Soft Link IP Core for Consumer Electronics Applications

December 1, 2008 -- Silicon Image, Inc. today announced its 225 MHz HDMI version 1.3 PHY solution, consisting of the SiI9204 HDMI v1.3 transmitter PHY semiconductor and companion HDMI v1.3 link layer intellectual property (IP) core for use in consumer electronics and high-end mobile device applications. This latest offering complements the Silicon Image family of HDMI v1.3 transmitters which include stand-alone discrete semiconductors, PHY semiconductors for use with link layer IP cores and full HDMI v1.3 link and PHY IP cores.

Silicon Image Introduces 225 MHz HDMI v1.3 PHY IC and Soft Link IP Core for Consumer Electronics Applications

solutions can be found at www.siliconimage.com.

Silicon Image Introduces 225 MHz HDMI v1.3 PHY IC and Soft Link IP Core for Consumer Electronics Applications

Silicon Image, Inc. (NASDAQ:SIMG), a leader in semiconductors and intellectual property for the secure distribution, presentation and storage of high-definition content, today announced its 225 MHz HDM version 1.3 PHY solution, consisting of the SiI9204 HDMI v1.3 transmitter PHY semiconductor and companion HDMI v1.3 link layer intellectual property (IP) core for use in consumer electronics and high-end mobile device applications. This latest offering complements the Silicon Image family of HDMI v1.3 transmitters which include stand-alone discrete semiconductors, PHY semiconductors for use with link layer IP cores and full HDMI v1.3 link and PHY IP cores.

Silicon Image Introduces 225 MHz HDMI v1.3 PHY IC and Soft Link IP Core for Consumer Electronics Applications

SUNNYVALE, Calif.—(BUSINESS WIRE)—December 1, 2008— Silicon Image, Inc. (NASDAQ:SIMG), a leader in semiconductors and intellectual property for the secure distribution, presentation and storage of high-definition content, today announced its 225 MHz HDMI™ version 1.3 PHY solution, consisting of the SiI9204 HDMI v1.3 transmitter PHY semiconductor and companion HDMI v1.3 link layer intellectual property (IP) core for use in consumer electronics and high-end mobile device applications. This latest offering complements the Silicon Image family of HDMI v1.3 transmitters which include stand-alone discrete semiconductors, PHY semiconductors for use with link layer IP cores and full HDMI v1.3 link and PHY IP cores.

EV Group Introduces New Suite of Aligners and Measurement Systems for 3D IC and Other Advanced Semiconductor, MEMS and Nanotechnology Device Manufactu

The 'NT' Series Significantly Increases Both Alignment and Measurement Accuracy to Enable Better Device Performance and Lower Manufacturing Costs

Make way for software-based mobile TV

Armed with a reconfigurable multi-standard tuner IC, Mirics Semiconductor, a U.K.-based startup, claims that it still remains the only company offering a software-based TV and radio demodulator.

Will software-based mobile TV kick start PC TV?

Armed with a reconfigurable multi-standard tuner IC, Mirics Semiconductor, a U.K.-based start-up, claims that it still remains the only company offering a software-based TV and radio demodulator.

Will software-based mobile TV kick start PC TV?

Armed with a reconfigurable multi-standard tuner IC, Mirics Semiconductor, a U.K.-based start-up, claims that it still remains the only company offering a software-based TV and radio demodulator.

Ambarella's unique view on the future of digital cameras leads to a unique view on SoC architecture

Ron WilsonEDN Executive Editor Ron Wilson explores how IC design teams really work: the struggle for power efficiency and performance, wrestling with semiconductor processes and design methodologies, the challenges of global design teams. How do we somehow herd architecture, IP, design and verification into a successful tape-out?

Atmel Unveils Industry's Smallest Laser Diode Driver Solution Supporting HD-DVD/Blu-ray, DVD and CD Format

Heilbronn, Germany, July 10, 2007. . . Atmel® Corporation (Nasdaq: ATML) announced today the availability of the ATR0881 laser diode driver IC for use in combined HD-DVD/Blu-ray, DVD, and CD drives. The ATR0881 is housed in a 4 mm x 4 mm QFN24 package. This is the industry's smallest laser diode driver solution and is especially suited for small slim drives used in notebook computers as well as for half-height drives in desktop PCs and consumer DVD recorders.

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